Abstract
Favorable temperature- and size-dependent device characteristics in mechanically flexible, thin (∼6.45 μm thick), microscale inorganic InGaN/GaN-based light-emitting diodes enable their use as highly efficient, robust devices that are capable of integration on diverse classes of unconventional substrates, including sheets of plastic. Finite element analysis and systematic studies of the operational properties establish important thermal, electrical, and optical considerations for this type of device.
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