Abstract
Abstract Due to the decreasing size of components in the semiconductor industry, TEM sample preparation grows increasingly difficult. And at the same time the customer need for TEM analysis increases, along with the urgency to report the data. We have found that TEM sample preparation has been greatly improved using the combination of the Allied High Tech MultiPrep™ System (Figure 1) in conjunction with the Gatan Broad Beam Guns™ with the Graphite Holder and accessories. The technique discussed in this paper will show that this procedure for sample preparation has decreased the time it takes to prepare the sample, decreased the number of failing samples and increased the ability to do high resolution imaging. The MultiPrep™ is used when repeatability is critical for sample preparation and eliminates the function of holding the polisher by hand. When polishing by hand the amount of force placed on the sample while polishing is inconsistent.
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