Abstract
Abstract In the November issue of this publication, we described how focused ion beam (FIB) microsurgery is used to successfully cross-section and prepare material-specific samples for SEM and TEM analysis. Material specific samples have two or more components possessing different characteristics, such as hardness and chemical etch or sputtering rates. Traditional sample preparation techniques (mechanical grinding and polishing, broad ion beam etching, and chemical etching) alter, delaminate, or destroy these samples. FIB handles the preparation of these difficult samples well because of its milling geometry and the high current density of the small beam.
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