Telephone cord buckles—A relation between wavelength and adhesion

Abstract

Thin films with low adhesion and large residual stresses may buckle. The resulting morphologies are varied, but one of the most commonly observed is an intriguing oscillating pattern – the so-called “telephone cord” – which has been extensively investigated in the recent years. We have studied the kinematics of formation of telephone cords using a geometrically non-linear plate model and mode dependent interfacial toughness, captured via a cohesive zone. Through extensive Finite Element Simulations, we have demonstrated a simple, non-trivial relation between telephone cord wavelength and interfacial toughness. To validate this prediction, highly stressed Mo thin films were deposited on Si wafers, with a well defined interface and very reproducible adhesion. Studying the morphology of the resulting buckles for different film thicknesses and stresses, we observed a trend which was fully consistent with our simulation results. From the data fit, an adhesion energy of 0.58±0.04Jm−2 for the SiO2/Ag interface was inferred, which compares well with literature estimates.