Abstract
This paper reviews the present status and future needs of the thin film depositions-namely physical and chemical vapor depositions. The continuing shrinkage of the devices and circuits has placed demands not only on finding the new materials but more so on the technology of their application on such devices, circuits, and chips. After a brief review of the physical and vapor deposition technologies the changing needs are discussed including the emerging partially ionized beam technique. Effect of increasing wafer and die sizes and decreasing device dimensions, use of statistical process control and process simulations, emerging concepts of multiple process equipments and in-situ processing, and manufacturability are briefly discussed.
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