Technique of a Multipower X-Ray Analysis of Products of Microelectronics with Non-Uniform Structure

Abstract

The analysis of the existing systems of nondestructive x-ray control of products of microelectronics, their main opportunities and characteristics testifies to need of introduction of a multipower X-ray analysis method allowing to expand possibilities of a digital X-ray analysis for microelectronics products with non-uniform structure. The developed technique allows us to receive the minimum set of digital x-ray images of a product of microelectronics with non-uniform structure due to a reasonable choice of commands to a source of x-ray radiation in order to actuate the "working" modes of exposition. The specified set of images provides the possibility of monitoring product defects by results of visualization of the internal structure of all its functional elements with the demanded quality.