Abstract

The strategy of incorporating self‐assembled monolayers (SAMs) with anchoring groups is an effective and promising method for interface engineering in perovskite solar cells with metal oxide charge‐transporting layers. However, coating SAM layers in upscaled perovskite solar modules (PSMs) using slot‐die coating is challenging due to the low viscosity and wettability of the solutions. In this study, a triphenylamine‐based polymer poly([{5‐[4‐(diphenylamino)phenyl]‐2‐thienyl}(4‐fluorophenyl)methylene]malononitrile) (pTPA)–TDP, blended with SAM based on 5‐[4‐[4‐(diphenylamino)phenyl]thiophene‐2‐carboxylic acid, is integrated to address these challenges. And, p–i–n‐oriented PSMs on 50 × 50 mm2 substrates (12 sub‐cells) are fabricated with a NiO hole‐transport layer and organic interlayers for surface modification. Wetting angle mapping shows that ununiform regions of the slot‐die‐coated SAM has extreme hydrophobicity, causing absorber thickness fluctuations and macro‐defects at buried interfaces. The blended interlayer at the NiO/perovskite junction homogenizes surface wettability and mitigates lattice strain, enabling the effective use of SAM properties on large surfaces. This improved energy level alignment, enhancing the power conversion efficiency of the modules from 13.98% to 15.83% and stability (ISOS‐L‐2, T80 period) from 500 to 1630 h. In these results, the complex effects of using SAM in slot‐die‐coating technology for large‐scale perovskite photovoltaics are highlighted.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.