Tailoring the efficient laser‐absorption‐melting behavior of Bi2O3‐B2O3‐ZnO‐Nd2O3 glass for the OLED encapsulation

Abstract

AbstractThe efficient 810 nm laser energy conversion of glass frit had been proven to be the key to the long‐term hermetic encapsulation of Organic Light Emitting Display (OLED). A direct laser energy conversion laser‐assisted Bi2O3‐B2O3‐ZnO‐Nd2O3 sealing glass material without extra laser absorbent such as carbon black, was designed and systematically investigated. The addition of Nd2O3, as glass modifiers with higher cationic field strength, could be conducive to enhancing the polymerization of glass network structure, manifesting that the glass‐transition temperature Tg, onset‐crystallization temperature Tc and thermal stability ΔT (ΔT = Tc‐Tg) increased, while thermal expansion coefficient CTE dropped to 9.72×10−6/°C and advantageously matched with the glass substrate (8±1×10−6/°C). More importantly, the absorption rate of BBZ‐Nd glass was more than 50 % between 800∼810 nm owing to the 4f‐4f electron transition of Nd3+ ions, and yet the reflectivity and transmittance of the wavelength at 800–810 nm were lower. As optimal compositions, the addition of 3.0 wt% Nd2O3 in Bi2O3‐B2O3‐ZnO‐Nd2O3 glass frit with higher absorption coefficients (80 %) led to instantaneous bonding encapsulation between glass substrates without interfacial cracks or pores with the 808 nm wavelength of the laser at 20 W and 2.4 mm/s.