Abstract
Porous metallic films have received emerging interests in the fields of catalysts, fuel cells, lithium batteries, and phase-change heat transfer devices. Substrate topography is known to have a strong impact on adhesion and morphology of porous coating layers prepared by electrodeposition. In this study, we have tailored the topography of a Cu substrate by wet etching in a sodium persulfate/sulfuric acid (SPS) solution prior to electrodeposition of porous Cu films. An analytic approach is proposed to quantitatively analyze nucleation and growth of dendritic Cu deposits on the SPS-treated Cu substrates. Such a dendritic porous Cu film can serve as a capillary wick to complete recirculation of condensed liquid in the phase-change heat transfer devices. The maximum heat transfer rate of a heat pipe or vapor chamber indeed is proportional to the capillary performance (K/Reff ) of the wick structure, where K and Reff stand for liquid permeability and effective pore radius of the wick, respectively. A large K/Reff value of 0.975 µm has been attained for the electrodeposited dendritic Cu film on a Cu substrate with an optimal SPS etching treatment. The influence of dendritic deposits on the wicking performance of the electrodeposited Cu film is investigated. Figure 1
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