Abstract
An extraordinarily strong suppressor additive (IPEG) for copper plating has been synthesized by the copolymerization of imidazole and poly(ethylene glycol) diglycidyl ether (PEG-DGE). This new IPEG polymer contains the typical functional groups of both PAG (poly(alkylene glycol)) and IMEP (polymerizate of imidazole and epichlorohydrin) polymers. The new IPEG polymer combines the properties of PAG (typical suppressor for Damascene applications) and IMEP (state-of-the-art leveler for Damascene applications). The combination of two suppressing modes of action in a single polymer results in significant enhancement of the suppressing capacity of this new IPEG polymer over that of conventional suppressors and levelers.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
