Tailored cure profiles for simultaneous reduction of the cure time and shrinkage of an epoxy thermoset

Abstract

Defining the specific cure profile of thermosetting polymers is an important aspect in many applications where the mechanical performance and appearance of components can be affected. Cure-induced strains or stresses from the shrinkage of thermosets lead to reduced performance due to accelerated damage or discarded products due to distortions. This research focuses on validating a proposed modelling framework, simulating the load-transferring part of the curing process affecting the mechanical performance. The model's accuracy is evaluated against experimental results, and the model prediction is found to be within an accuracy of 2-8% of the experimental results. A 16-hour and 31-hour two-stage cure profile was compared and validated experimentally. The short profile results in a higher cure-induced of -0.56% with the longer profile yielding -0.46% cure-induced strain. Based on the model, a new three-stage cure profile has been proposed. Using this, it is possible to achieve a low level of cure-induced strain of -0.45% at a shorter cure time on 18 h.