T1602-3-3 超微細塑性加工と異方性エッチングを利用した微細溝加工([T1602-3]マイクロナノ理工学:nmからmmまでの表面制御とその応用(3))

Abstract

In this paper, a new nanofabrication process is proposed to fabricate nanostructures on silicon substrate. The process utilizes metal coating instead of using resist mask. The metal layer is patterned using nano plastic forming (NPF) followed by sputter etching, instead of ultraviolet lithography or electron beam lithography patterning. Then the pattern is transferred into the substrate by anisotropic chemical wet etching. Finally, the excess metal layer is removed to reveal nanostructure on the silicon substrate. The proposed process was experimentally studied and arrays of nano trenchs narrower than 20 nm in width were fabricated on silicon (110) wafer.