Abstract

The moon and Mars are extreme environments for electronics in terms of both low temperatures and wide temperature extremes. A system-in-package (SiP) approach has been chosen to build electronics capable of operating in these extreme environments without the need for warm electronics boxes to maintain an earth-like environment. The SiP is based on thin film copper/polyimide substrate technology with embedded passive components. Both wire bond and flip chip assembly are being used. The assembly is hermetically packaged in an alumina package.

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