Abstract
Systems-in-foil are an emerging new class of flexible electronic products in which complete systems are integrated in thin polymeric foils. First, a brief overview of the basic material choices and fabrication concepts will be given. Then, more detailed attention will be paid to the approaches of heterogeneous integration of thin chips. The different integration process flows and challenges and application fields will be described for three distinct areas: (1) ultra-thin chip packages with high density interconnects; (2) embedded circuitries for low cost flip-chip attachment to flexible substrates; and (3) embedded optical chips. It is important also to balance secondary material properties like thermal expansion, elastic moduli and adhesion strengths of different materials used to facilitate reliable operation of systems-in-foil under mechanical bending and at varied temperatures.
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