Abstract
Transmission electron microscopy (TEM) has been instrumental in advancing the field of crystalline defect analysis. Conventional TEM imaging techniques, such as bright field (BF), dark field (DF), and weak beam dark field (WBDF or g–3g) imaging, have been well-documented in the scientific literature, with simulation methods readily available for each. The present contribution highlights the use of a field-emission TEM, operated in scanning transmission electron microscopy mode, as a viable tool for defect analysis. Common techniques such as two-beam diffraction contrast and zone axis imaging are applied to defect analysis; both experimental and computational results are presented. Effects of experimental parameters such as camera length, beam divergence angle, and diffraction aperture placement are also discussed and illustrated by both experimental and computed micrographs of stacking faults.
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