Systematic evaluation of cyanate ester/ epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications

Abstract

The power electronics industry has been actively seeking high temperature stable epoxy molding compound (EMC) materials that can meet the requirements for encapsulating future SiC chips operating at a temperature (250 °C) that exceeds the capability of current epoxy chemistry. This work provides a detailed evaluation of a high heat resistant cyanate ester (CE)/epoxidized cresol novolac (ECN) copolymer system with varied compositions regarding their high temperature performances. Owing to the novolac nature of ECN which provides a high crosslink density, it is found that the copolymers with a low CE concentration (25–33 mol%) are able to produce a comparable glass transition temperature (>230 °C) and decomposition temperature (T10%>400 °C) to those of the high CE formulations. Moreover, long-term high temperature (250 °C) storage test of reveals a less severe weight loss and blistering in the lower CE formulations. A distinguished degradation mechanism involving hydrolysis of unreacted cyanate groups in the high CE compositions was determined through various thermal and chemical analyses. It was concluded that the CE/ECN copolymers with low CE concentrations are promising candidates for the high temperature EMC formulation.