Abstract

The systematic strain measurement error in Digital Image Correlation (DIC) induced by the environment temperature variation around the digital camera was extensively studied. The temperature variation of different camera components along with the changes of the environment temperature is experimentally studied and the motions of different components are then analyzed. The strain error in DIC is then analyzed according to a physical model to express the imaging geometry changes. Finally, the DIC measurement error caused by environment temperature variation was experimentally verified.

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