Abstract

The effective production of nanopatterned films generally requires a nanopatterned roll mold with a large area. We report on a novel system to fabricate large-area roll molds by recombination of smaller patterned areas in a step-and-repeat imprint lithography process. The process is accomplished in a method similar to liquid transfer imprint lithography (LTIL). The stamp roll with a smaller area takes up the liquid resist by splitting from a donor substrate or a donor roll. The resist is then transferred from a stamp roll to an acceptor roll and stitched together in a longitudinal and, if necessary, in a circumferential direction. During transfer, the nanostructured resist is UV-exposed and crosslinked directly on the acceptor roll. The acceptor roll with the stitched and recombined stamp patterns is ready to be used as a large-area roll mold for roll-based imprinting. A system for this purpose was designed, and its operation was demonstrated taking the example of an acceptor roll of 1 m length and 250 mm diameter, which was covered by 56 patterned areas. Such a system represents an elegant and efficient tool to recombine small patterned areas directly on a large roll mold and opens the way for large-area roll-based processing.

Highlights

  • Roll-based nanoimprint lithography (Roll-NIL) has been studied and developed for the fabrication of nanopatterns on large and flexible film substrates

  • An acceptor roll with a maximum length to of 1016 mm andthe a diameter ofprocess, 250 mmas can be loaded onto acceptorfrom roll the withsystem

  • Since the acceptor roll was covered with a PET film, the film was peeled off and an arbitrary position was selected to measure after the experiment

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Summary

Introduction

Roll-based nanoimprint lithography (Roll-NIL) has been studied and developed for the fabrication of nanopatterns on large and flexible film substrates. It is difficult to fabricate nanopatterns onto such a large-area roll. The dip-coating [12,13,14] and spray-coating [15,16] of the resist on the roll surface were studied as alternatives to spin coating. It is difficult to dip a large-area roll with a length of a few hundreds of mm into a resist container. The resist is successfully coated on the large-area roll surface, the properties of the resist may change during the process since the process time for the large-area is relatively longer than that for a single wafer substrate

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