Abstract
Non-noble metal copper nanoparticles encapsulated within h-BN (Cu@h-BN) were successfully synthesized by annealing copper ammine complexes and KBH4 under flowing nitrogen gas at 900℃. Results indicated copper nanoparticles with an average size of 50–150nm embedded in h-BN nanosheets of c.a. 5nm. The few-layered h-BN capsules could effectively prevent the metal from oxygenation in the air up to c.a. 414℃, suggesting remarkable chemical inertness under high temperature. Furthermore, Cu@h-BN exhibited an excellent thermal conductivity of 253.7Wm−1K−1 in air atmosphere, suggesting its potential application for electrical packaging and thermal management.
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