Abstract

Polymer nanocomposite-based dielectric materials are playing a vital role in the area of electrical insulation research and developments. The nanoparticle dispersion and interface region are the crucial parts of these developments. This chapter begins with the description of physical properties and their derived nanoparticles of polyimide (PI) films. Then, the detailed synthesis process of PI/nanocomposite multilayer film and its optimization is discussed in this chapter. Several factors in the synthesis process, which can influence the quality of the film, are discussed. After synthesis, the dielectric properties such as space charge were measured, and the results are compared with single and multilayer PI/nanocomposite films. Simulations and modeling help to shed light on the experimental results and create an understanding of polymer nanocomposite properties. Therefore, the PI/nanocomposite multilayer 3D model based on boundary conditions obtained from SEM/TEM images of synthesized samples was also constructed and simulated in COMSOL multiphysics software. The nanoparticle agglomeration and the impact of nanoparticle dispersion on the electrical properties of the material are described in detail in this model. The results demonstrate that the nanoparticle dispersion is improved by using a thin layer of PI/nanocomposite on PI film. As a result, fewer space charges and low electric fields are observed in multilayer films.

Highlights

  • Electrical insulations are the key components for electric motors, which are used in space crafts and electric trains

  • A brief introduction of the physical properties of PI films and their derived nanoparticles was described in this chapter

  • A detailed synthesis process optimization of multilayer PI nanocomposite films is described in this chapter to understand all variables, which can influence the dielectric properties of the final product

Read more

Summary

Introduction

Electrical insulations are the key components for electric motors, which are used in space crafts and electric trains. Various research results have claimed that polymer nanocomposite materials can improve dielectric properties for electrical insulation applications [1–4]. It seemed like magic that everything is possible by using nanodielectrics, which later proved wrong after understanding the exact working principles of polymerbased nanocomposites, though several questions still need to be solved [5]. This has motivated the author to explore in this field further and find those principles by using experimental and simulation work on improving the dielectric properties of polyimide-based nanocomposite. A detailed synthesis process optimization is described at the end of this chapter to understand all variables that can alter the dielectric properties of the polyimide nanocomposite films

Polyimide insulation films and their physical properties
Dielectric constant and dielectric loss
Conduction current
Dielectric breakdown strength
Corona discharge resistance and material degradation
Insulation structure design flaws
Physical properties of nanodielectric-based polyimide
Inorganic filling particles
Particles’ size, shape, and types
Coupling agents
Plasma treatment
Synthesis of polyimide
Preparation mechanism for polyamic acid (PAA)
Monomer reactivity conditions
Factors involved in the molecular weight of PAA
Synthesis of PAA/nanoparticle composite solution
PI film casting using glass and brass substrate
2.10 Determination of the degree of imidization using FTIR
Findings
Conclusions

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.