Abstract
To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2′-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu2+ content. Among them, their dielectric constants (εrS) were up to 43% superior to that of the neat PI, glass transition temperatures (Tgs) were all over 400 °C, and 5% weight loss temperature (T5%) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors.
Highlights
Polymer film capacitors have been attractive in many research efforts for recent years owing to their low cost, self-healing nature, graceful failure, and flexibility [1,2,3]
The supramolecular polymers that exploit metal–ligand interactions, possess high dielectric constant because of the improved permanent dipoles caused by metal atoms [16,17], and the metal-crosslinking can further improve their thermal and mechanical properties [17,18]
ODA, pyromellitic dianhydride (PMDA), triethylamine (Et3 N), p-Toluenesulfonic acid (p-TSA), Cupric(II) acetylacetonate (Cu(C5 H7 O2 )2 ), 80% hydrazine monohydrate, 10% palladium on charcoal and other reagents were purchased from Sinopharm
Summary
Polymer film capacitors have been attractive in many research efforts for recent years owing to their low cost, self-healing nature, graceful failure, and flexibility [1,2,3]. Various modified PIs have been widely studied, generally including a mixture with high dielectric constant fillers and modifications of molecular architecture [7,13,14,15] These successful methodologies led to a great increase of dielectric properties, the former causes the degradation of mechanical properties owing to the phase segregation of fillers and the latter brings the reduced thermal properties with the employment of flexible blocks (e.g., ether linkage). The supramolecular polymers that exploit metal–ligand interactions, possess high dielectric constant because of the improved permanent dipoles caused by metal atoms [16,17], and the metal-crosslinking can further improve their thermal and mechanical properties [17,18].
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
