Abstract
CMP is commonly recognized to be the most effective technique of achieving global planarization. SiO2 and CeO2 abrasives are the most commonly used in CMP slurries due to their good polish performance. To consider respectiveSubscript text advantages and synergistic effect, preparation of SiO2/CeO2 composite nanoparticles with core/shell structure have become a hot topic in CMP field. We introduced the preparation technology of SiO2/CeO2 and their applications in CMP in recent years.
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