Abstract
Abstract Single crystal silicon was implanted with molecular oxygen with energies ranging from 80 to 240 keV in a non-channeling direction. Rutherford backscattering (RBS) analysis was used to obtain the oxygen/silicon atomic ratio depth profiles and the thickness of the buried oxide layer, for doses ranging from 1016 to 1. 5 × 1018 O2+/cm2. This work links the early low energy work and the more recent higher energy work, and generally excellent agreement has been obtained. The minimum energy for formation of buried silicon dioxide has been identified as 160 keV per oxygen molecule and corresponding oxygen dose of 6 × 1017 O2+/cm2.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
