Abstract
With increasing development of chip and circuit integration, the requirements regarding the viscosity, activity, and thermomechanical properties of underfill are becoming increasingly stringent. However, common low-viscosity resins are often obtained with poor thermal and thermomechanical properties. In this study, natural renewable pyrogallol was used as a raw material and preparedto prepare a high-performance polyphenol epoxy resin monomer named E3PG (pyrogallol triglycidyl ether) through employing a combination of epichlorohydrin and olefin epoxidation methods for the first time. At 25°C, the viscosity of E3PG was only 210 cps, indicating excellent processability. Compared with traditional epoxy resin (E51), E3PG has a lower activation energy, and more importantly, exhibits excellent thermomechanical properties after curing; its glass transition temperature (Tg) reaches 164°C, and its storage modulus (E′) reaches 3500 MPa at 25°C. In this study, an epoxy resin monomer with excellent properties was successfully prepared using renewable polyphenols as raw materials, providing a unique and novel approach for the synthesis of epoxy resin monomers.
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