Abstract
In the present study, millimeter CS-TPP@MnFe2O4 gel beads (particle size 3–4 mm) were prepared by the sol-gel process using the embedding method, and its performance of Cu(II) and influence factors were studied. The effect of various parameters such as the gel bead addition amount, adsorption time, temperature, pH, and competitive substances (anion and cationic) was studied. The surface and properties of gel beads were characterized by X-ray diffraction (XRD), Fourier transforms infrared spectroscopy (FTIR), and transmission electron microscopy (TEM). The experimental results showed that the optimal pH for adsorption of Cu(II) by CS-TPP@MnFe2O4 was 5–7, the adsorption of Cu(II) reached equilibrium at 24 h, and the maximum adsorption capacity could reach 125.70 mg g−1 at 298.15 K by Langmuir isotherm model. K+, Na+, Cl−, NO3−, and SO42− had little effect on the adsorption, and Ca2+, Mg2+, and H2PO4− inhibited the adsorption, and SiO32− and humic acid (HA) promoted the adsorption of Cu(II) by the adsorbent. After five adsorption-desorption experiments, the desorption rate of gel beads reached 89.3%, and the adsorption capacity of Cu(II) was still high. In conclusion, the CS-TPP@MnFe2O4 gel beads are a type of stable and effective materials to remove Cu(II) from water.
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