Abstract
AbstractA novel photosensitive low viscosity epoxy resin was synthesized by polyethylene glycol (PEG)‐modified bisphenol‐A epoxy resin (E51). The resin was modified by ethylene glycol, diethylene glycol, and different molecule weights (200,300,400) PEGs to optimize the minimum viscosity. FTIR was used to determine molecule structure. Cationic photoinitiator (UVI‐6976) mixed with modified resin (10 wt %), was utilized to boost the resin curing under UV light. The curing degree was beyond 90% within 40 s and the whole process was monitored by photo‐DSC. The modified resin diluted with ethylene glycol diglycidyl ether, was screen printed onto polyimide and polyethylene terephthalate substrate, and the properties of solder mask were up to China printed circuit association standard. The solder resist also meet all requirements under ink‐jet printing technology as the viscosity is under 60 mPa·s and the curing duration is <1 min. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
