Synthesis of group-IV ternary and binary semiconductors using epitaxy of GeH3Cl and SnH4

Abstract

Ge1−x−ySixSny alloys were grown on Ge buffers via reactions of SnH4 and GeH3Cl. The latter is a new CVD source designed for epitaxial development of group-IV semiconductors under low thermal budgets and CMOS-compatible conditions. The Ge1−x−ySixSny films were produced at very low temperatures between 160 and 200 °C with 3%–5% Si and ∼5%–11% Sn. The films were characterized using an array of structural probes that include Rutherford backscattering, x-ray photoelectron spectroscopy, high-resolution x-ray diffraction, scanning transmission electron microscopy, and atomic force microscopy. These studies indicate that the films are strained to Ge and exhibit defect-free microstructures, flat surfaces, homogeneous compositions, and sharp interfaces. Raman was used to determine the compositional dependence of the vibrational modes indicating atomic distributions indistinguishable from those obtained when using high-order Ge hydrides. For a better understanding of the growth mechanisms, a parallel study was conducted to investigate the GeH3Cl applicability for synthesis of binary Ge1−ySny films. These grew strained to Ge, but with reduced Sn compositions and lower thicknesses relative to Ge1−x−ySixSny. Bypassing the Ge buffers led to Ge1−ySny-on-Si films with compositions and thicknesses comparable to Ge1−ySny-on-Ge; but their strains were mostly relaxed. Efforts to increase the concentration and thickness of Ge1−ySny-on-Si resulted in multiphase materials containing large amounts of interstitial Sn. These outcomes suggest that the incorporation of even small Si amounts in Ge1−x−ySixSny might compensate for the large Ge–Sn mismatch by lowering bond strains. Such an effect reduces strain energy, enhances stability, promotes higher Sn incorporation, and increases critical thickness.