Synthesis of Copper/Silicon-Carbide Composites in a Thermodynamic Disequilibrium

Abstract

Composites with interpenetrating metal-ceramic microstructures (IPC, interpenetrating composites) can be tailored for specific applications, such as high thermal conductivity combined with low thermal expansion, e.g. for heat sinks. Heat sinks are required in power electronic devices or in future fusion reactor technology where extreme conditions and high cyclic thermo-mechanical loads appear. Due to its rigid ceramic backbone IPCs are expected to reveal high thermal stability. Pure silicon carbide exhibits high thermal conductivity, low coefficient of thermal expansion, high corrosion and wear resistance. But it is also known as a very brittle material when mechanical loads are applied. Thus a composite of silicon carbide with ductile and highly conductive copper seems to be a promising new material for a number of applications.This paper reports the synthesis of Cu-SiC composites using a unique high temperature squeeze casting process (HTSC). Microstructural design of SiC-preforms with open porosity and its synthesis progress is reported. Influence of preform properties, temperature, pressure and atmosphere during HTSC were investigated. A qualitative and quantitative description of the microstructure of the composites and their composition allows the creation of structure-property correlations that take effect retroactively to the casting process.