Abstract

A new class of compounds, ω-(thiophen-3-yl) alkyl phosphonic acids, was used to link conductive polythiophene layers and several metal oxide substrates. In general, the adhesion between polythiophene films and metal substrates is insufficient for technical and microelectronic applications. The use of adhesion promoters between the substrate and the polymer enables the formation of a strongly bonded composite. Adhesive compounds were synthesized which contained a phosphonic acid group attached to the substrate and a thienyl group for surface polymerization with thiophene monomers. The properties of these created adhesion promoters were characterized on several substrates by contact angle measurements and IR investigations. First successful attempts were made to obtain a structured polymer surface via micro-contact printing.

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