Abstract
The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency identification (RFID) and light emitting diode (LED) industries, with limited usage in semiconductor packaging. The use of printed ink in semiconductor IC packaging is limited by several factors such as poor electrical performance and mechanical strength. Poor adhesion of the printed metal track to the epoxy molding compound is another critical factor that has caused a decline in interest in the application of printing technology to the semiconductor industry. In this study, two different groups of adhesion promoters, based on metal and polymer groups, were used to promote adhesion between the printed ink and the epoxy molding substrate. The experimental data show that silver ink with a metal oxide adhesion promoter adheres better than silver ink with a polymer adhesion promoter. This result can be explained by the hydroxyl bonding between the metal oxide promoter and the silane grouping agent on the epoxy substrate, which contributes a greater adhesion strength compared to the polymer adhesion promoter. Hypotheses of the physical and chemical functions of both adhesion promoters are described in detail.
Highlights
Several conventional printing methods have been developed for forming a conductive track on various printing substrates
Conventional methods such as chemical etching, screen printing and vacuum deposition have been applied to various substrates such as epoxy, polymer and silicon wafer substrates
The screen printing method is another alternative for patterning and is often used in the newspaper printing industry
Summary
Several conventional printing methods have been developed for forming a conductive track on various printing substrates Conventional methods such as chemical etching, screen printing and vacuum deposition have been applied to various substrates such as epoxy, polymer and silicon wafer substrates. The chemical etching method is performed by first creating a layer of conductive film on the desired substrate surface, followed by a photolithography step to fabricate the required circuit pattern [1]. This method has been widely used in silicon device fabrication, which requires high-end accurate geometry in the sub-nanometer range. In the screen printing process, conductive inks are printed directly on the desired substrate, using a mask to form the conductive tracks
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