Abstract
In this study, hybrid composite films (HCFs) consisting of aligned Si nanowires (SiNWs) and a photoresist polymer were prepared and their applicability to nanomaterial assembly and pattern transfer onto various substrates, including curved surfaces, was demonstrated. The synthesis and transfer of the HCFs can be scaled up to large areas. Transfer of the HCFs, when performed immediately after a UV-exposure step, enabled direct patterning of fine features on curved surfaces. The unique feature of this approach was further exploited to fabricate a new type of SiNW electronic device that can conform to non-planar surfaces without strain.
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