Abstract
Polyfunctional silylureas were synthesized by the interaction of 3-aminopropyltriethoxysilane with isocyanates of various structures in an inert aromatic solvent. Commercially available diisocyanates such as isophorone diisocyanate, hexamethylene diisocyanate, 2,4-toluene diisocyanate were used as isocyanates. In this case, freshly distilled toluene was used as a solvent. The structures of the obtained compounds were confirmed by the data of IR and NMR1H spectroscopy. Using the synthesized compounds, formulations of compositions for electrodeposition of a tin-indium alloy on a copper wire were developed. The possibility of using silylureas of various structures as effective surfactants used in the electrodeposition of the tin-indium alloy is shown. The operational characteristics of the obtained wire were investigated, including the wire diameter, coating thickness, tensile strength, electrical resistance, and direct current electrical resistivity.
Highlights
One of the most important tasks of increasing the efficiency of photovoltaic solar modules is the search and development of new electrodes that provide high reliability of contact with crystalline silicon, as well as charge transfer in the cell [1]
Tin-plated copper wires were obtained with the POIN-52 grade Sn-In alloy, which is used as a solder in electrical engineering
Polyfunctional silylureas were synthesized via the interaction of 3-aminopropyltriethoxysilane with isocyanates of various structures, which were used as active surfactants in the electrodeposition of a tin-indium alloy
Summary
One of the most important tasks of increasing the efficiency of photovoltaic solar modules is the search and development of new electrodes that provide high reliability of contact with crystalline silicon, as well as charge transfer in the cell [1]. Copper wire coated with various alloys, which is currently one of the main materials in electrical engineering, is widely used as conductive electrodes [2]. The use of such a wire ensures the reliability and protection of solar modules from any external influences and, as a result, the indicator of the durability of the product itself increases [3]. The continuity of the contact of the electrode with monocrystalline silicon directly depends on the quality of the surface of the copper wire and the adhesion strength of the coating to the copper base, which affects the efficiency of transferring the converted light energy into electricity [6]. To obtain a microscopic adhesive layer of a copper wire coating, electrodeposition of a tin-indium alloy in various electrolytes can be used, but it is impossible to predict the effect of technological additives on the properties of the resulting coating; in most cases, the electrolyte composition is selected experimentally [6]
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