Abstract
AbstractSilicone‐epoxy polymers (SEP) with different n(SiH)/n(CC) ratios were synthesized through the hydrosilylation reaction of diallyl bisphenol A epoxy resin (DADGEBA) and hydrogen‐containing silicone oil (HS) with long silicone chain. The structure of SEP was characterized by Fourier transform infrared spectroscopy (FTIR), nuclear magnetic resonance spectroscopy (1H NMR), and gel permeation chromatography (GPC), and the compatibility of the curing system was studied by dynamic mechanical analysis (DMA) and scanning electron microscope (SEM). DMA and SEM results showed that after curing with epoxy curing agent, the compatibility of the curing system was excellent. The mechanical, bonding, and thermal properties of the cured product were also measured. The cured product exhibited superior thermal stability and mechanical properties. High toughness of SEP was provided by the long silicone chain, and high mechanical strength was provided by the cross‐linking networks. The maximum tensile strength was 15.64 MPa, the maximum elongation at break was 62%, and the maximum tensile lap‐shear strength was 8.89 MPa. The silicone‐epoxy polymers can be widely used in electronic packaging in the future.
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