Abstract
New polyimides have been prepared from 2,2[prime]-bis(fluoroalkoxy)benzidines and several dianhydrides. The new diamines, with fluoroalkoxy groups OCF[sub 3], OCF[sub 2]CF[sub 2]H, and OCF[sub 2]CFHOC[sub 3]F[sub 7], were obtained from the corresponding 3-(fluoroalkoxy) nitrobenzenes by reduction to hydrazo derivatives, followed by benzidine rearrangements. High-quality polyimide films from these diamines have been prepared by standard procedures and their thermal, mechanical, and electrical properties compared to known polyimides, including those derived from 2,2[prime]-bis(trifluoromethyl) benzidine. Polymers from the diamine with OCF[sub 3] substituents show an especially favorable combination of low dielectric constant, moisture absorption, and coefficient of thermal expansion (CTE) and high thermal stability, suggesting promise as a next-generation material for electronics applications. Polymers from diamines with the largest fluoroalkoxy substituents have very low moisture absorption, but surprisingly high CTE.
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