Abstract
Deposition of a coating on rough surfaces faces unique challenges due to the complexity of substrate morphology. In the present research, electroless deposition of a Ni-P coating was successfully deposited on diamond particles. Microtomography was conducted to study the deposition mechanisms. It revealed that the coating coverage rate on diamond particles was affected by the synergistic action of the deposition time, substrate morphology, and hypophosphite concentration. The best coverage was achieved in a solution with 0.2 mol/L hypophosphite. Two major morphological features of the coating: nodular and smooth, were influenced by the deposition parameters, coating integrity, and substrate morphology. The failure was seen in fractured and peeled off coatings. It was due to residual stress produced by the coalescing of crystallites during the deposition. This failure mechanism explains the tendency of coating fracture at three morphological features of the substrate. This work is beneficial to semiconductor manufacturing where effective cutting in chip fabrication is essential.
Highlights
Electroless deposition is the process of metalizing a surface in the absence of an external electrical source
This deposition method has been implemented to metalize the interconnects for ultralarge-scale integration (ULSI) technology [2,3,4,5]
The coating coverage rate is an important indicator to evaluate the effectiveness of the coating process on diamond particles
Summary
Electroless deposition is the process of metalizing a surface in the absence of an external electrical source It has been adopted as a simple and cost-effective method to synthesize Ni-P coatings on various substrates [1]. Electroless deposition is suitable to deposit films on complex geometric surfaces such as through-holes and blind recesses (vias) in the printed circuit board due to its uniform thickness, good solderability, and ability to deposit on non-conductive materials. This deposition method has been implemented to metalize the interconnects for ultralarge-scale integration (ULSI) technology [2,3,4,5]. Electroless deposition of ternary and quaternary alloys [6,7,8,9,10] and metal-ceramic composite [11,12,13,14,15] or metal-polymer composites [16,17,18] are under the spotlight of current research because of the unique and tunable properties of the deposited materials
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