Abstract
AbstractMetal‐organic framework (MOF) thin films currently lack the mechanical stability needed for electronic device applications. Polymer‐based metal‐organic frameworks (polyMOFs) have been suggested to provide mechanical advantages over MOFs, however, the mechanical properties of polyMOFs have not yet been characterized. In this work, we developed a method to synthesize continuous sub‐5 μm polyUiO‐66(Zr) films on Au substrates, which allowed us to undertake initial mechanical property investigations. Comparisons between polyUiO‐66 and UiO‐66 thin films determined polyUiO‐66 thin films exhibit a lower modulus but similar hardness to UiO‐66 thin films. The initial mechanical characterization indicates that further development is needed to leverage the mechanical property advantages of polyMOFs over MOFs. Additionally, the demonstration in this work of a continuous surface‐supported polyUiO‐66 thin film enables utilization of this emerging class of polyMOF materials in sensors and devices applications.
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