Abstract
UV-curable polydimethylsiloxane epoxy acrylate (PESA) was synthesized by reacting epoxy polydimethylsiloxane with acrylic acid (AA). It is shown that the optimum synthesis temperature for PESA is 100–110°C and triethylamine is best one among those catalysts tested. The structure of the oligomer was characterized by FT-IR, 1H-NMR, GPC and UV spectra. The photosensitive properties of as-synthesized PESA were investigated using IR and gel yield method. It is noted that the PESA system shows a notable photosensitivity, which is 27.8mJ/cm2. PESA cured film exhibited a tensile strength of 6.34MPa, hardness of 1–2H, water absorption of 1.45% and decomposition temperature of 402.2°C. The as-synthesized PESA resin may find great application in UV-curing optical fiber, metal and glass coating and solder mask materials for printed circuit.
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