Abstract
Novel epoxy resins containing copper have been synthesized by reacting copper acrylate with bisphenol A and excess epicholorohydrin. Values of as epoxy equivalent weight, hydroxyl content and hydrolyzable chlorine content have been estimated. The resins have been characterized by IR, 1H-NMR and 13C-NMR analysis. The cured resins were evaluated for thermal properties. The curing of resins has been carried out with polyamide at 30 °C and with phenacyl dimethyl sulfonium ylide mercuric chloride complex by heating at 150 °C for 8 h and at 180 °C for 3 h. The cured resins have improved electrical properties and excellent thermal and chemical resistance in comparison with the control resin. The reaction follows first-order kinetics with activation energies of 47 and 34 kJ/mol in the presence and absence, respectively, of copper actrylate. The copper forms a complex with bisphenol A, as indicated by spectroscopic studies, which increases the epoxidation rate.
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