Abstract
In this report, the metal-vapor synthesis (MVS) was used for the preparation of copper nanoparticles which was then used for the preparation of chitosan–copper nanocomposite. The antifungal activity of Cu@Chit NCs against two sclerotium-forming plant pathogenic fungi Sclerotium rolfsii (S. rolfsii) and Rhizoctonia solani (R. solani) AG-4 was evaluated in vitro and their effects on hyphal morphology, and sclerotia formation were observed for the first time. The NCs were prepared through impregnation of chitosan with colloid solution of copper nanoparticles in organic solvent (acetone or toluene). Transmission electron microscopy shows that the particles have predominantly spherical form, polydisperse character, the mean diameter about 2–3 nm and a rather uniform distribution in the chitosan matrice. Analysis of the small angle scattering curves suggests that the copper particles in the NCs with the size of ≤2 nm are mostly located in the chitosan pores with the same size. The effect of Cu@Chit NCs on fungal growth reveals some significant inhibitory activity against two tested fungi. The highest level of inhibition against S. rolfsii and R. solani AG-4 was observed using the high concentrations of Cu@Chit NC prepared using acetone as a solvent. A loss of the cytoplasm content, cytoplasmic coagulation, irregular shape of mycelia, or destruction in the hyphae was confirmed. The experiments demonstrate that the Cu@Chit NC synthesized via MVS using acetone was more effective than that of toluene in inhibiting fungal hyphae growth against R. solani AG-4 and S. rolfsii. The results show that the Cu@Chit NCs are fungicidal against both the tested fungus at high concentrations and the fungicidal or fungistatic activity is dependent on the tested fungus species.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.