Abstract
We have synthesized a thermally curable polymeric gate insulator (TFVOB-SPI) through the modification of soluble polyimide (SPI) using a 4-(1,2,2-trifluorovinyloxy)benzoyl (TFVOB) chloride. The thermal cross-linking of TFVOB-SPI was done and prepared the cross-linked TFVOB-SPI thin film having the perfluorocyclobutane (PFCB) structure. The PFCB structure was formed by the radical mediated thermal cycloaddition of trifluorovinyl ether of TFVOB. The cross-linked TFVOB-SPI showed excellent thermal stability up to 495 °C with only 5% weight loss and excellent chemical resistance to common organic solvents. The pentacene thin-film transistor (TFT) with the cross-linked TFVOB-SPI as a gate dielectric exhibited a field effect mobility of 0.28 cm2/Vs with almost no hysteresis during the TFT operation.
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