Abstract
To realise high performance in IC devices, it is necessary to reduce the RC delay, cross talk, and power consumption. An effective method to make these reductions is to decrease the parasitic capacitance by employing a low dielectric constant (low-k) material in the intermetal dielectrics (IMD). The present research topic deals with the synthesis and characterisation of gold doped in ceria-silica, derived from rice husk biomass materials. Large amount of silica recovered from waste rice husk silica, hence the silica materials derived from waste product can be the low cost and used for potential application such as low-k dielectric material development. Gold doping on ceria-mixed silica derived from rice husk is carried out by insitu method (Au/Ce-silica-A) and deposition-co precipitation method (Au/Ce-silica-B). Au/Ce-silica-A and Au/Ce-silica-B shown the low-k dielectric constant compared to bulk ceria-silica.
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