Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism

Abstract

Four anthraquinone quaternary phosphate molecules (AQS-a, AQS-b, AQS-c, AQS-d) with different electrostatic adsorption areas were constructed as electroplating levelers based on the strategy of expanding the electrostatic adsorption area of the molecules. AQS-d with the largest electrostatic adsorption area was demonstrated to have the most excellent electrochemical performance by electrochemical tests. The physicochemical adsorption sites and interactions with copper ions of AQS levelers were proposed by theoretical calculations, molecular dynamics simulations, Raman spectroscopy and fluorescence absorption spectroscopy, and the electroplating salt bridge mechanism was proposed. Based on optical microscope, scanning electron microscope, atomic force microscope and X-ray diffractometer, it is proved that AQS-d has the ability to perfectly fill the microvia in actual plating by actual PCB blind hole filling experiment.