Abstract
In this study, thermally conductive composite films were fabricated using an anisotropic boron nitride (BN) and hybrid filler system mixed with spherical aluminum nitride (AlN) or aluminum oxide (Al2O3) particles in a polyimide matrix. The hybrid system yielded a decrease in the through-plane thermal conductivity, however an increase in the in-plane thermal conductivity of the BN composite, resulting from the horizontal alignment and anisotropy of BN. The behavior of the in-plane thermal conductivity was theoretically treated using the Lewis–Nielsen and modified Lewis–Nielsen theoretical prediction models. A single-filler system using BN exhibited a relatively good fit with the theoretical model. Moreover, a hybrid system was developed based on two-population approaches, the additive and multiplicative. This development represented the first ever implementation of two different ceramic conducting fillers. The multiplicative-approach model yielded overestimated thermal conductivity values, whereas the additive approach exhibited better agreement for the prediction of the thermal conductivity of a binary-filler system.
Highlights
Heat generation in electronic devices has a significant effect on the performance of these devices; various methods of thermal control have recently attracted considerable attention
aluminum nitride (AlN) were added to the binary filler
In the case of the through-plane direction, the hybrid filler system shows lower thermal conductivity than the PI/boron nitride (BN) composite, whereas in-plane thermal conductivity was enhanced because the BN particles were horizontally aligned via the binary filler
Summary
Heat generation in electronic devices has a significant effect on the performance of these devices; various methods of thermal control have recently attracted considerable attention. Zhaid et al reported the graphene supported thermal interface material (TIM), which has outstanding thermal and electrical conductivity by a simple fabrication process [8]. Among these materials, BN seems the most promising, owing to its high thermal conductivity (up to 400 W/m·K) and relatively low dielectric constant (approximately four), compared with those of other ceramic fillers. Chen et al [15] fabricated epoxy composites with two types of spherical Al2 O3 to control the viscosity and thereby improve the processability; these composites exhibited high thermal conductivity. A detailed model prediction for the composites is presented and used for the incorporation of two fillers
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