Abstract

Lignosulfonate (LS) was successfully introduced into the epoxy resin matrix with the aid of ethylene glycol (EG) dissolution. Both the rigid LS and soft EG segments were linked into the cross-linked network structure of epoxy resin via esterification of hydroxyl groups in LS and EG molecules with anhydride. The ultimate properties of cured samples were adjusted effectively by changing the proportion of LS and EG components. Curing reaction and kinetics were analyzed, by which the optimal curing process parameters were determined. Although thermal stability of LS itself was relatively lower than that of neat epoxy, the thermal performance was significantly enhanced for the modified sample of epoxy/LS0.5-EG0.5. At the same time, the flexural strength, flexural modulus and impact strength were found to be increased by 23.1, 35.7 and 15.1% respectively compared with the neat epoxy. In addition, the excellent shape memory behavior and improved mechanical stability with LS addition were exhibited by the cured LS-EG modified specimens. This work reveals that lignin can be used as an efficient functional additive to regulate thermal, mechanical and shape memory properties of epoxy resin.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call