Abstract

Rational interface engineering is essential for minimizing interfacial nonradiative recombination losses and enhancing device performance. Herein, we report the use of bidentate diphenoxybenzene (DPOB) isomers as surface modifiers for perovskite films. The DPOB molecules, which contain two oxygen (O) atoms, chemically bond with undercoordinated Pb2+ on the surface of perovskite films, resulting in compression of the perovskite lattice. This chemical interaction, along with physical regulations, leads to the formation of high-quality perovskite films with compressive strain and fewer defects. This compressive strain-induced band bending promotes hole extraction and transport, while inhibiting charge recombination at the interfaces. Furthermore, the addition of DPOB will reduce the zero-dimensional (0D) Cs4PbBr6 phase and produce the two-dimensional (2D) CsPb2Br5 phase, which is also conducive to the improvement of device performance. Ultimately, the resulting perovskite films, which are strain-released and defect-passivated, exhibit exceptional device efficiency, reaching 10.87% for carbon-based CsPbBr3 device, 14.86% for carbon-based CsPbI2Br device, 22.02% for FA0.97Cs0.03PbI3 device, respectively. Moreover, the unencapsulated CsPbBr3 PSC exhibits excellent stability under persistent exposure to humidity (80%) and heat (80 °C) for over 50 days.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.