Abstract
Synchrotron radiation real-time imaging technology was conducted to in situ investigate the liquid-solid thermomigration behavior in Cu/Sn/Ni solder joint. Asymmetrical growth of the intermetallic compounds (IMCs) at the two ends (interfaces) was clearly observed in the Cu/Sn/Ni solder joint during reflow on a hot plate. The thickness of the IMC layer at the cold end increased linearly with reflow time, while that at the hot end changed little, resulting in increasing difference in IMC thickness between the two ends with reflow time. Due to the thermomigration of Ni atoms toward the cold end under temperature gradient, the (Cu,Ni) 6 Sn 5 IMCs grew quite fast at the cold end. The changes in the morphology of the (Cu,Ni) 6 Sn 5 grains at cold end associated with the increasing Ni content. Cu atoms from the cold end could migrated across the liquid solder layer to the hot end against temperature gradient, resulting in the formation of a smooth (Cu,Ni) 6 Sn 5 layer at the hot end.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.