Abstract
Double barrier magnetic tunnel junctions (DBMTJs) with the layer structures of Ta (5nm)/Ni79Fe21(40nm)/Ir22Mn78(10nm)/Co75Fe25(4nm)/Al(1nm)-oxide/Co75Fe25(8nm)/Al(1nm)-oxide/Co75Fe25(4nm)/Ir22Mn78(10nm)/Ni79Fe21(30nm)/Ta(5nm) on Si/SiO2 wafer were micro-fabricated using a TMR R&D magnetron sputtering system and lithography method. TMR ratios of 30.0% and 22.1%, resistance-area product RS of around 32.0 and 27.5kΩμm2, and free layer coercivity of 201 and 141Oe at 4.2K and room temperature (RT), respectively, were obtained for the MTJs with a size of 80×80μm2. Static and dynamic domain structures occur as the DC current increases and magnetization switching properties are simulated based on micromagnetics using the energy minimization method. TMR ratios in DBMTJs that are far lower than the expected theoretical values can be clarified based on micromagnetics simulations due to the vortex domain structures formed in the free layer.
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