Swelling-enhanced catalytic degradation of brominated epoxy resin in waste printed circuit boards by subcritical acetic acid under mild conditions

Abstract

Waste printed circuit boards (WPCBs) contain a large amount of brominated epoxy resins (BERs), which may cause environmental problems. However, BERs degradation under mild conditions is challenging due to the good thermal and chemical stabilities of BERs. This study proposes a mild and efficient method that uses subcritical acetic acid (220 °C–260 °C, 2.6–3.6 MPa) to decompose BERs. BERs swell quickly at 200 °C and are thoroughly decomposed into bisphenol A and phenol at 220 °C when the acetic acid mass concentration and holding time are fixed at 49.90% and 1 h, respectively. Experimental results show that subcritical acetic acid has excellent swelling and catalytic degradation effects on BERs. The quick swelling of BERs allows the free migration of the catalyst in the epoxy network and thus significantly enhances the catalytic degradation effect. Therefore, BERs can be thoroughly decomposed by subcritical acetic acid under mild conditions. Temperature and acetic acid concentration are the major parameters that control the resin degradation rate. Bromine-free oil phase products are obtained at ≥240 °C. The possible decomposition pathway of BERs in subcritical acetic acid is also investigated. Most of the bromine is transformed into HBr and enriched in the aqueous phase. In conclusion, the proposed mild method could be used as a novel practical and industrial procedure for the degradation and debromination of BERs.