Abstract
This paper seeks to inform of the need for, and approaches to, sustaining critical thermal protection systems (TPS) for in-situ planetary missions in the coming decade. The key technologies, HEEET and PICA, are needed only for these NASA missions, will not be sustained in the absence of use, and are at risk of atrophy in the absence of mitigation.
Highlights
The technologies discussed are needed for the severe entry environments that will be encountered in missions deploying landers, probes, aerial platforms, and for skimmer missions [1]
Some of the challenges associated with sustaining thermal protection systems (TPS), due to low mission cadence, came into play with the TPS material SLA-561V between the Mars Viking and Pathfinder missions [5] and again between the Mars Science Laboratory (MSL) backshell and the Mars Interior Exploration using Seismic Investigations, Geodesy and Heat Transport heatshield (InSight, built in 2015) missions
NASA should perform annual assessments of future Heatshield for Extreme Entry Environment Technology (HEEET) demand, starting material availability, processing equipment and integration procedure/personnel readiness o Annual assessments should be conducted to determine whether technology atrophy risk has changed, and the HEEET Sustainability Assessment document [12] should be updated based on this information. o If the risk becomes high, NASA ARC should bring a funding proposal forward to HQ to mitigate the risk through manufacturing, integration or other means
Summary
The technologies discussed are needed for the severe entry environments that will be encountered in missions deploying landers, probes, aerial platforms, and for skimmer missions [1]. In addition to the capabilities discussed above, unique testing infrastructure (such as arc jets and laser facilities) and specialized tools/skills (including aerothermal predictions, TPS material selection and sizing, thermo-structural analysis of complex integrated elements) are required to enable in-situ planetary missions.
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