Abstract
The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
